產品規(guī)格書/Specification
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產品/product: |
包封漿料/ package paste |
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料號/part number: |
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適用范圍/Application:
該款漿料適合于電路、電阻片外封標識,外層包封，可用于玻璃、陶瓷、不銹鋼、鋁合金等基材
The paste is suitable for marking thick film circuit and outside package, glass, ceramic, metal, etc.
使用條件/Operating conditions：
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基材 Substrate |
厚膜電路、玻璃、陶瓷、金屬等 thick film circuit, glass, ceramic, metal, etc. |
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使用方法 Method of use |
印刷，200-250目 Printing, 200-250mesh |
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流平 Levelling |
5-10min minutes at room temperature 室溫下流平5-10分鐘（時間根據流平的實際情況決定）。 |
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固化 Curing conditions |
通風烘箱烘烤150~200℃，20-30分鐘 (固化溫度可以在150 150~ ( It could be cured at a temperature between 150~ |
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稀釋劑 Thinner |
ST-1001 |
性能/Characteristics：
1. 漿料性能/Paste Characteristics：
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性能Characteristic |
標準Standard |
測試方法及條件 Test method and conditions |
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1 |
細度 Fineness |
≤8μm |
FOG test |
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2 |
粘度Viscosity |
80~150Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25± Brookfield HBT（博利飛）粘度計， 轉子SC4-14/6R), 10rpm, 25± |
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3 |
Appearance 外觀 |
白色，黑色，藍色，綠色 white, black，blue, green |
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2. 燒結后特性/Characteristics after curing：
在1燒結條件下，Check fired film produced under the conditions specified in 1）,
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特性 Characteristics |
Standard 標準 |
測試方法和條件 Test method and conditions |
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4 |
Acid resistance 耐酸性 |
Fine 良好 |
Marinate in 5% H2S04, 30mins, no difference with standard sample 5%硫酸，30分鐘無變化 |
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5 |
Insulation resistance 絕緣系數 |
---- |
RCJ-30 |
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6 |
Breakdown voltage 擊穿電壓 |
---- |
CS |
保存條件，有效期/Storage condition and Term of validity
產品應在5-15℃的環(huán)境溫度下密封儲存，有效期為產品發(fā)貨之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5
包裝方式/Packaging method：
標準包裝，
Standard package
